Because the electronic component fixing glue can protect electronic components, increase the life of electronic components, glue can be cured to waterproof and dustproof, insulation, thermal conductivity, corrosion resistance, temperature resistance, confidentiality and shock effect.
The beginning of electronic components is used for encapsulating epoxy resin sealant has small shrinkage, no by-products and a little electrical insulating properties, but the molecular structure of the limitation of resistance to thermal cracking after recycling, can only be used at room temperature under the condition of electronic components.
In order to solve the hot and cold resistant epoxy resin sealant after cyclic cracking this problem, people have developed polyurethane, polyurethane and strong ability to adapt to the environment of seismic performance and resistance to thermal cycling performance is good, but the actual use of encapsulant but when the surface is too soft, foaming, curing is not sufficient and prone to high temperature curing sealing surface is not smooth crisp, poor toughness, easy aging and short life, anti ultraviolet ability easy discoloration, acid resistance.
Finally, after people continue to develop, the birth of the silicone gel suitable temperature range, can work normally in the -50 to 250 DEG C under high and low temperature resistance, electrical insulation, resistance to oxidation stability, weather resistance, flame retardant, water repellent, corrosion resistance, non-toxic and tasteless and physiologically inert. Excellent properties of glue after curing after mechanical processing in the process does not appear deformation, the electrical properties of excellent physical and mechanical properties of good maintenance. Applicable to the harsh environment of the field of high technology.